PCB Electroplating Filter Machine, Special Filter for Circuit Board

PCB special filter is a circulating filtration equipment specially designed for strong acid, strong alkali and corrosive chemical liquids in printed circuit board production. It is widely used in wet processes such as electroplating, etching, copper deposition and cleaning. It effectively removes copper powder, anode slime, suspended particles and organic impurities, so as to ensure chemical liquid purity and improve PCB production yield.

1. Core Application Scenarios in PCB Process

Electroplating (Copper Plating / Tin Plating / Gold Plating / Silver Plating)

Remove copper powder and carbon residue to avoid board defects such as pinholes, nodules and short circuits. Filtration precision: 0.5–5μm; equipped with PP/PTFE filter cartridges.
Etching & Micro-etching

Filter copper slag and prevent nozzle blockage. Bag filter type is commonly used with precision of 10–100μm, featuring high dirt holding capacity.
Copper Deposition & Electroless Nickel Gold Plating

High temperature resistance and anti-metal ion precipitation. Main body made of PPH/PVDF material; shaftless magnetic pump to prevent liquid leakage.
VCP Vertical Continuous Electroplating

High flow rate of 30–60m³/h; dual-tank standby design to support non-stop high-speed production.

2. Key Structure & Corrosion-resistant Materials

Main Material: PPH (Homopolymer Polypropylene) / PVDF (Polyvinylidene Fluoride), resistant to strong acid, strong alkali, cyanide and organic solvents, no metal contamination.
Filtration Core Configuration
- Filter Cartridge Type: High precision 0.5–5μm, suitable for high-precision copper/gold plating; standard 30/40-inch PP/PTFE cartridges.
- Filter Bag Type: Large flow & easy maintenance, precision 10–100μm, applied to etching and stripping process.
Pump: Shaft-seal free magnetic drive acid & alkali resistant pump, anti-leakage, anti-dry running, adaptable to high temperature liquid up to 60–80℃.
Sealing & Safety: FKM/EPDM sealing rings; pressure relief and overpressure protection design for safe operation.

3. Main Models & Selection Guidelines

High-precision cartridge filter: For pattern electroplating and VCP production
High-temperature resistant filter: For electroless nickel and copper deposition process
Bag filter: For etching, micro-etching and stripping working fluid
Activated carbon integrated filter: Online removal of organic pollutants to stabilize plating solution

4. Core Selection Factors

Chemical Liquid Property: PPH for regular acid liquid; PVDF for strong corrosion and high temperature working conditions.
Filtration Precision: 0.5–1μm for HDI high-density circuit boards; 1–5μm for conventional copper plating; 10–50μm for etching process.
Flow Rate Matching: Realize 2–4 times tank liquid circulation per hour according to tank volume.
Continuous Production: Dual-tower one-for-one standby design for mass production lines.

5. Daily Maintenance Tips

Replace filter cartridges/bags timely when pressure difference exceeds 0.2MPa.
Regularly inspect magnetic pump and sealing accessories to avoid crystallization and leakage.
Periodically replace activated carbon to prevent secondary pollution after saturation.

👉 Contact our engineers for a more suitable pump solution.